Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676910 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2023-06-13 |
| 11574877 | Semiconductor miniaturization through component placement on stepped stiffener | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2023-02-07 |
| 11562954 | Frame-array interconnects for integrated-circuit packages | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2023-01-24 |