Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11837577 | System-in-package module | Kyung Suk Oh, Eunseok Song, Seung-Yong Cha | 2023-12-05 |
| 11830853 | Semiconductor devices and methods for manufacturing the same | Young Lyong Kim | 2023-11-28 |
| 11784137 | Semiconductor device and method for fabricating the same | Yun-Rae Cho, Seung Hun Han | 2023-10-10 |
| 11784171 | Semiconductor device | Inhyo Hwang | 2023-10-10 |
| 11776866 | Semiconductor module heatspreading lid having integrated separators for multiple chips | Shle-Ge Lee, Youngbae Kim | 2023-10-03 |
| 11769746 | Semiconductor package | Kyungseon Hwang, Sunwon Kang | 2023-09-26 |
| 11664292 | Semiconductor package | Seung-Duk Baek, Tae Heon Kim | 2023-05-30 |
| 11610785 | Semiconductor packages | Seokhyun Lee, Kyoung Lim Suk, Jaegwon Jang | 2023-03-21 |