Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848308 | Semiconductor package | Wansoo Park, Sang-Sub Song | 2023-12-19 |
| 11837577 | System-in-package module | Ae-Nee Jang, Eunseok Song, Seung-Yong Cha | 2023-12-05 |
| 11783879 | Memory device comprising programmable command-and-address and/or data interfaces | Ian Shaeffer, Lawrence Lai, Fan Ho, David A. Secker, Wayne S. Richardson +2 more | 2023-10-10 |
| 11756850 | Chip on film package and display device including the same | Seung-Tae Hwang, Jae Choon Kim, Woon-bae Kim, Jae-Min Jung | 2023-09-12 |
| 11688441 | On-die termination of address and command signals | Ian Shaeffer | 2023-06-27 |
| 11664348 | Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor package | Do Hyun Kim, Sunwon Kang | 2023-05-30 |
| 11637070 | Method of fabricating a semiconductor package | Hae-Jung Yu | 2023-04-25 |