Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848308 | Semiconductor package | Wansoo Park, Kyung Suk Oh | 2023-12-19 |
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Joonyoung Oh | 2023-10-17 |