Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Boseong Kim, Sang-Sub Song, Joonyoung Oh | 2023-10-17 |
DK
Dongok Kwak
Overall (2023): #460,990 of 537,848Top 90%
1
Patents 2023