Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791321 | Method of fabricating semiconductor package and semiconductor package | Tae Young Lee, Dongok Kwak, Boseong Kim, Sang-Sub Song | 2023-10-17 |
JO
Joonyoung Oh
Overall (2023): #385,626 of 537,848Top 75%
1
Patents 2023