Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11848255 | Semiconductor package structure on a PCB and semiconductor module including the same | YoungJoon Lee | 2023-12-19 |
| 11769746 | Semiconductor package | Ae-Nee Jang, Kyungseon Hwang | 2023-09-26 |
| 11664348 | Substrate assembly semiconductor package including the same and method of manufacturing 1HE semiconductor package | Kyung Suk Oh, Do Hyun Kim | 2023-05-30 |