Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu +1 more | 2022-10-04 |
| 11430756 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jifeng Zhu, Jun Chen, Li Xiao | 2022-08-30 |
| 11430775 | Semiconductor device with exposed input/output pad in recess | He Chen, Shu Wu, Yong Qing Wang, Liang Xiao | 2022-08-30 |
| 11251043 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Bi Feng Li, Qingchen Cao, Yaobin Feng, Zhiliang Xia +1 more | 2022-02-15 |