Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11378525 | Systems and methods for evaluating critical dimensions based on diffraction-based overlay metrology | — | 2022-07-05 |
| 11251043 | Method and structure for cutting dense line patterns using self-aligned double patterning | Lu Fan, Zi Qun Hua, Bi Feng Li, Qingchen Cao, Zhiliang Xia +1 more | 2022-02-15 |