Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Jia Wen Wang, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11322392 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Jifeng Zhu | 2022-05-03 |
| 11289422 | Bonding alignment marks at bonding in interface | Meng Yan, Jia Wen Wang, Shun Hu | 2022-03-29 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jifeng Zhu, Jun Chen, Zhenyu Lu | 2022-03-15 |