Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462474 | Three-dimensional memory devices having a plurality of NAND strings | Zhenyu Lu, Jun Chen, Yushi Hu, Qian Tao, Simon Shi-Ning Yang +1 more | 2022-10-04 |
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Shi Qi Huang, Jun Chen +1 more | 2022-10-04 |
| 11430756 | Bonded semiconductor structures having bonding contacts made of indiffusible conductive materials and methods for forming the same | Zongliang Huo, Jun Liu, Jun Chen, Zi Qun Hua, Li Xiao | 2022-08-30 |
| 11322392 | Method for forming lead wires in hybrid-bonded semiconductor devices | Meng Yan, Si Ping Hu | 2022-05-03 |
| 11276642 | Method for forming three-dimensional integrated wiring structure and semiconductor structure thereof | Jun Chen, Si Ping Hu, Zhenyu Lu | 2022-03-15 |