Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11531203 | Near-to-eye display method and apparatus and wearable device | Wei Wang, Qiuyu Ling, Xiaochuan Chen | 2022-12-20 |
| 11502058 | Hybrid wafer bonding method and structure thereof | — | 2022-11-15 |
| 11418196 | Method and apparatus for dynamic routing using heterogeneous and disjoint networks | Omar Mahmoud Adfal Alnagger, Myron Shak, Soheil Gharahi | 2022-08-16 |
| 11353706 | Augmented reality display device and pair of augmented reality glasses | Yujiao Guo, Wei Wang, Gaolei Xue, Xianqin Meng, Xiandong Meng +6 more | 2022-06-07 |
| 11322392 | Method for forming lead wires in hybrid-bonded semiconductor devices | Jifeng Zhu, Si Ping Hu | 2022-05-03 |
| 11289422 | Bonding alignment marks at bonding in interface | Jia Wen Wang, Si Ping Hu, Shun Hu | 2022-03-29 |