Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Shi Qi Huang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11342185 | Wafer bonding method and structure thereof | Shuai Guo, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2022-05-24 |
| 11289422 | Bonding alignment marks at bonding in interface | Meng Yan, Si Ping Hu, Shun Hu | 2022-03-29 |