Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508731 | Semiconductor structure and manufacturing method thereof | — | 2022-11-22 |
| 11342185 | Wafer bonding method and structure thereof | Jia Wen Wang, Tao Ding, Rui Xing, Xiao Jin Wang, Jia Wang +1 more | 2022-05-24 |
| D945402 | Earphone | Chen Yu, Yang Liu | 2022-03-08 |
| D940073 | Earphone charging box | Chen Yu, Yang Liu | 2022-01-04 |