Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11342185 | Wafer bonding method and structure thereof | Shuai Guo, Jia Wen Wang, Tao Ding, Xiao Jin Wang, Jia Wang +1 more | 2022-05-24 |
| 11257706 | Semiconductor device flipping apparatus | Mengyong Liu, Tao Ding, Wu Liu, Guoliang Chen | 2022-02-22 |