XW

Xiao Jin Wang

YC Yangtze Memory Technologies Co.: 1 patents #107 of 257Top 45%
📍 Hubei, CN: #135 of 411 inventorsTop 35%
Overall (2022): #206,939 of 548,613Top 40%
1
Patents 2022

Issued Patents 2022

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
11342185 Wafer bonding method and structure thereof Shuai Guo, Jia Wen Wang, Tao Ding, Rui Xing, Jia Wang +1 more 2022-05-24