Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462503 | Hybrid bonding using dummy bonding contacts | Tao Wang, Si Ping Hu, Jia Wen Wang, Jifeng Zhu, Jun Chen +1 more | 2022-10-04 |
| 11348936 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2022-05-31 |
| 11342352 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Wei Liu | 2022-05-24 |
| 11270770 | Local word line driver device, memory device, and fabrication method thereof | Cheng Gan, Wei Liu, Shunfu Chen | 2022-03-08 |