Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538780 | Structure and method for isolation of bit-line drivers for a three-dimensional NAND | Liang Chen, Cheng Gan | 2022-12-27 |
| 11450653 | Bonded three-dimensional memory devices having bonding layers | Shiqi Huang, Bater Chelon, Siping Hu | 2022-09-20 |
| 11437464 | Structure and method for forming capacitors for a three-dimensional NAND | Liang Chen, Cheng Gan, Shunfu Chen | 2022-09-06 |
| 11387124 | Wafer container and method for holding wafer | Chi-Chung Jen, Jui-Ming Huang, Wan-Ting Liao | 2022-07-12 |
| 11348936 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Shi Qi Huang | 2022-05-31 |
| 11342352 | Three-dimensional memory devices and fabricating methods thereof | Liang Chen, Lei Xue, Shi Qi Huang | 2022-05-24 |
| 11302627 | On-chip capacitors in three-dimensional semiconductor devices and methods for forming the same | Liang Chen, Lei Xue | 2022-04-12 |
| 11270770 | Local word line driver device, memory device, and fabrication method thereof | Cheng Gan, Shi Qi Huang, Shunfu Chen | 2022-03-08 |
| 11264455 | Backside deep isolation structures for semiconductor device arrays | Shunfu Chen, Cheng Gan | 2022-03-01 |
| 11232825 | Capacitor structure and method of forming the same | Liang Chen, Cheng Gan, Xin Wu | 2022-01-25 |
| 11233041 | Bonded three-dimensional memory devices and methods for forming the same | Shiqi Huang, Bater Chelon, Siping Hu | 2022-01-25 |