Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495569 | Metal-dielectric bonding method and structure | — | 2022-11-08 |
| 11450653 | Bonded three-dimensional memory devices having bonding layers | Shiqi Huang, Wei Liu, Bater Chelon | 2022-09-20 |
| 11233041 | Bonded three-dimensional memory devices and methods for forming the same | Shiqi Huang, Wei Liu, Bater Chelon | 2022-01-25 |