Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11523503 | Wiring board and method of forming hole thereof | Chen-Hao Lin, Bo-Cheng Lin | 2022-12-06 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
| 11476234 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Chi-Hai Kuo, Cheng-Ta Ko | 2022-10-18 |
| 11462452 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko | 2022-10-04 |
| 11445617 | Package structure and manufacturing method thereof | Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11424216 | Electronic device bonding structure and fabrication method thereof | Chia-Fu Hsu, Pu-Ju Lin, Cheng-Ta Ko | 2022-08-23 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Tzyy-Jang Tseng, Ra-Min Tain | 2022-08-09 |
| 11300585 | Apparatus and method for measuring structural angular acceleration based on dynamic centrifugal force measurement | Jianbo Li, Shiyun Xiao, Runyu Mei, Zhiqiang Hu, Lei Zhou +2 more | 2022-04-12 |
| 11219130 | Circuit board and manufacturing method thereof | Chen-Hao Lin | 2022-01-04 |