Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540396 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Shao-Chien Lee, Chen-Hua Cheng, Ra-Min Tain | 2022-12-27 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11410933 | Package structure and manufacturing method thereof | Cheng-Ta Ko, Pu-Ju Lin, Tzyy-Jang Tseng, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |