Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540396 | Circuit board structure and manufacturing method thereof | Tzyy-Jang Tseng, Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng | 2022-12-27 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Tzyy-Jang Tseng, Kai-Ming Yang | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-08-09 |
| 11410971 | Chip package structure | Tzyy-Jang Tseng, Pu-Ju Lin, Cheng-Ta Ko | 2022-08-09 |
| 11373927 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole | Chin-Sheng Wang, Pei-Chang Huang | 2022-06-28 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-06-14 |
| 11337303 | Circuit board structure | Chi-Chun Po, Po-Hsiang Wang | 2022-05-17 |