Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11445596 | Circuit board having heat-dissipation block and method of manufacturing the same | Chin-Sheng Wang | 2022-09-13 |
| 11373927 | Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through hole | Chin-Sheng Wang, Ra-Min Tain | 2022-06-28 |