Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Tzyy-Jang Tseng | 2022-11-29 |
| 11476234 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Chi-Hai Kuo, Kai-Ming Yang | 2022-10-18 |
| 11462452 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Kai-Ming Yang | 2022-10-04 |
| 11460255 | Vapor chamber device and manufacturing method thereof | Pu-Ju Lin, Ying Chen, Wei-Ci Ye, Chi-Hai Kuo | 2022-10-04 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11424216 | Electronic device bonding structure and fabrication method thereof | Chia-Fu Hsu, Kai-Ming Yang, Pu-Ju Lin | 2022-08-23 |
| 11410971 | Chip package structure | Tzyy-Jang Tseng, Pu-Ju Lin, Ra-Min Tain | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Yu-Hua Chen, Tzyy-Jang Tseng, Ra-Min Tain | 2022-08-09 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Pu-Ju Lin, Tzyy-Jang Tseng, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |
| 11366381 | Mask structure and manufacturing method thereof | Pu-Ju Lin, Shih-Lian Cheng, Yu-Hua Chen, Jui-Jung Chien, Wei-Tse Ho | 2022-06-21 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Ra-Min Tain, Tzyy-Jang Tseng | 2022-06-14 |