Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11476234 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Kai-Ming Yang, Cheng-Ta Ko | 2022-10-18 |
| 11460255 | Vapor chamber device and manufacturing method thereof | Pu-Ju Lin, Ying Chen, Wei-Ci Ye, Cheng-Ta Ko | 2022-10-04 |