Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540396 | Circuit board structure and manufacturing method thereof | Shao-Chien Lee, John Hon-Shing Lau, Chen-Hua Cheng, Ra-Min Tain | 2022-12-27 |
| 11516910 | Circuit board structure and manufacturing method thereof | Chia-Yu Peng, John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko | 2022-11-29 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Chen-Hao Lin, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen | 2022-09-13 |
| 11410971 | Chip package structure | Pu-Ju Lin, Cheng-Ta Ko, Ra-Min Tain | 2022-08-09 |
| 11410933 | Package structure and manufacturing method thereof | John Hon-Shing Lau, Cheng-Ta Ko, Pu-Ju Lin, Ra-Min Tain, Kai-Ming Yang | 2022-08-09 |
| 11410940 | Package structure with structure reinforcing element and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Yu-Hua Chen, Ra-Min Tain | 2022-08-09 |
| 11362057 | Chip package structure and manufacturing method thereof | Pu-Ju Lin, Cheng-Ta Ko, Ra-Min Tain | 2022-06-14 |
| 11335670 | Light emitting diode package structure and manufacturing method thereof | Ming-Ru Chen, Cheng-Chung Lo | 2022-05-17 |