Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516910 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11516910 | Circuit board structure and manufacturing method thereof | John Hon-Shing Lau, Kai-Ming Yang, Pu-Ju Lin, Cheng-Ta Ko, Tzyy-Jang Tseng | 2022-11-29 |