Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11523503 | Wiring board and method of forming hole thereof | Kai-Ming Yang, Bo-Cheng Lin | 2022-12-06 |
| 11445617 | Package structure and manufacturing method thereof | Kai-Ming Yang, Cheng-Ta Ko, John Hon-Shing Lau, Yu-Hua Chen, Tzyy-Jang Tseng | 2022-09-13 |
| 11219130 | Circuit board and manufacturing method thereof | Kai-Ming Yang | 2022-01-04 |