Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404386 | Semiconductor device package and method of manufacturing the same | Po-Jen Cheng, Fu-Yuan Chen, Wei Wang | 2022-08-02 |
| 11337303 | Circuit board structure | Ra-Min Tain, Chi-Chun Po | 2022-05-17 |