Issued Patents 2022
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11361986 | Using a liner layer to enlarge process window for a contact via | Li-Zhen Yu, Chih-Hao Wang, Yu-Ming Lin, Lin-Yu Huang | 2022-06-14 |
| 11355601 | Semiconductor devices with backside power rail and backside self-aligned via | Kuo-Cheng Chiang, Shi Ning Ju, Kuan-Lun Cheng, Chih-Hao Wang | 2022-06-07 |
| 11349004 | Backside vias in semiconductor device | Li-Zhen Yu, Huan-Chieh Su, Lin-Yu Huang, Chih-Hao Wang | 2022-05-31 |
| 11342326 | Self-aligned etch in semiconductor devices | Yi-Hsun Chiu, Ching-Wei Tsai, Yu-Xuan Huang, Shang-Wen Chang | 2022-05-24 |
| 11342413 | Selective liner on backside via and method thereof | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-05-24 |
| 11328990 | Via structure having a metal hump for low interface resistance | Li-Zhen Yu, Lin-Yu Huang, Yu-Ming Lin, Chih-Hao Wang | 2022-05-10 |
| 11316023 | Dumbbell shaped self-aligned capping layer over source/drain contacts and method thereof | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-04-26 |
| 11309212 | Semiconductor device structure and methods of forming the same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-04-19 |
| 11302798 | Semiconductor devices with air gate spacer and air gate cap | Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Ting-Ya Lo, Chi-Lin Teng +2 more | 2022-04-12 |
| 11264326 | Contact via formation | Lin-Yu Huang, Li-Zhen Yu, Kuan-Lun Cheng, Chih-Hao Wang, Chia-Hao Chang | 2022-03-01 |
| 11257673 | Dual spacer metal patterning | Yu-Chieh Liao, Chia-Tien Wu, Tai-I Yang, Hsin-Ping Chen | 2022-02-22 |
| 11257926 | Self-aligned contact structures | Li-Zhen Yu, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-22 |
| 11257758 | Backside connection structures for nanostructures and methods of forming the same | Li-Zhen Yu, Chia-Hao Chang, Lin-Yu Huang, Chih-Hao Wang | 2022-02-22 |
| 11251305 | Fin field effect transistor device structure and method for forming the same | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Yu-Ming Lin, Chih-Hao Wang | 2022-02-15 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Yung-Hsu Wu, Hsin-Ping Chen | 2022-02-08 |
| 11239325 | Semiconductor device having backside via and method of fabricating thereof | Lin-Yu Huang, Li-Zhen Yu, Chia-Hao Chang, Kuan-Lun Cheng, Chih-Hao Wang | 2022-02-01 |
| 11233005 | Method for manufacturing an anchor-shaped backside via | Chun-Yuan Chen, Huan-Chieh Su, Chih-Hao Wang | 2022-01-25 |
| 11222892 | Backside power rail and methods of forming the same | Huan-Chieh Su, Li-Zhen Yu, Chun-Yuan Chen, Shih-Chuan Chiu, Yu-Ming Lin +1 more | 2022-01-11 |