Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538749 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Cheng-Chin Lee, Kuang-Wei YANG, Chi-Lin Teng +2 more | 2022-12-27 |
| 11355430 | Capping layer overlying dielectric structure to increase reliability | Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-06-07 |
| 11322395 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-05-03 |
| 11302798 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Chi-Lin Teng +2 more | 2022-04-12 |