Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538749 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Kuang-Wei YANG, Ting-Ya Lo, Chi-Lin Teng +2 more | 2022-12-27 |
| 11527435 | Metal capping layer and methods thereof | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-12-13 |
| 11361989 | Method for manufacturing interconnect structures including air gaps | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-06-14 |
| 11355390 | Interconnect strucutre with protective etch-stop | Shao-Kuan Lee, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue | 2022-06-07 |
| 11355430 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue +1 more | 2022-06-07 |
| 11335596 | Selective deposition for integrated circuit interconnect structures | Hsin-Yen Huang, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-05-17 |
| 11322395 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-05-03 |
| 11227833 | Interconnect structure and method for forming the same | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2022-01-18 |
| 11222843 | Interconnect structure and method for forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2022-01-11 |