Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488838 | Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB | Xu Sheng Bao, Kang Chen | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Pandi C. Marimuthu, Il Kwon Shim, Byung Joon Han | 2022-11-01 |
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Pandi C. Marimuthu | 2022-11-01 |
| 11469191 | Antenna in embedded wafer-level ball-grid array package | Pandi C. Marimuthu, Andy Chang Bum Yong, Aung Kyaw Oo | 2022-10-11 |
| 11370655 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Won Kyoung Choi, Kang Chen, Ivan Micallef | 2022-06-28 |
| 11319207 | Semiconductor device and method of forming MEMS package | Il Kwon Shim | 2022-05-03 |
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Thomas Strothmann, Seung Wook Yoon | 2022-02-22 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Heinz-Peter Wirtz, Seung Wook Yoon, Pandi C. Marimuthu | 2022-01-11 |