Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Thomas Strothmann, Yaojian Lin | 2022-02-22 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Pandi C. Marimuthu | 2022-01-11 |