Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Seung Wook Yoon, Pandi C. Marimuthu | 2022-01-11 |