Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Il Kwon Shim, Yaojian Lin | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Il Kwon Shim, Byung Joon Han | 2022-11-01 |
| 11469191 | Antenna in embedded wafer-level ball-grid array package | Andy Chang Bum Yong, Aung Kyaw Oo, Yaojian Lin | 2022-10-11 |
| 11222793 | Semiconductor device with encapsulant deposited along sides and surface edge of semiconductor die in embedded WLCSP | Yaojian Lin, Heinz-Peter Wirtz, Seung Wook Yoon | 2022-01-11 |