Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Il Kwon Shim, Yaojian Lin, Pandi C. Marimuthu | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Il Kwon Shim | 2022-11-01 |