Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488932 | Semiconductor device and method of using a standardized carrier to form embedded wafer level chip scale packages | Byung Joon Han, Yaojian Lin, Pandi C. Marimuthu | 2022-11-01 |
| 11488933 | Semiconductor device and method of forming embedded wafer level chip scale packages | Yaojian Lin, Pandi C. Marimuthu, Byung Joon Han | 2022-11-01 |
| 11342278 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, InSang Yoon, KyoungHee Park | 2022-05-24 |
| 11319207 | Semiconductor device and method of forming MEMS package | Yaojian Lin | 2022-05-03 |