Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11393698 | Mask design for improved attach position | ChangOh Kim, JinHee Jung, OMin Kwon, Jiwon Lee, YuJeong Jang | 2022-07-19 |
| 11355452 | EMI shielding for flip chip package with exposed die backside | Dong Won Son, ByeongHoon Kim, Sung-Ho Choi, Sung Jae Lim, Jong-Ho Shin +2 more | 2022-06-07 |
| 11342278 | EMI shielding for flip chip package with exposed die backside | SungWon Cho, ChangOh Kim, Il Kwon Shim, InSang Yoon | 2022-05-24 |