Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Seung Wook Yoon, Yaojian Lin | 2022-02-22 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11257729 | Semiconductor device and method of forming encapsulated wafer level chip scale package (eWLCSP) | Seung Wook Yoon, Yaojian Lin | 2022-02-22 |