Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488838 | Semiconductor device having an embedded conductive layer for power/ground planes in Fo-eWLB | Yaojian Lin, Xu Sheng Bao | 2022-11-01 |
| 11370655 | Semiconductor device and method of forming microelectromechanical systems (MEMS) package | Yaojian Lin, Won Kyoung Choi, Ivan Micallef | 2022-06-28 |