Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11492699 | Substrate temperature non-uniformity reduction over target life using spacing compensation | Suhas Bangalore Umesh, Preetham Rao, Fuhong Zhang, Kishor Kalathiparambil, Martin Lee Riker +1 more | 2022-11-08 |
| 11417568 | Methods for selective deposition of tungsten atop a dielectric layer for bottom up gapfill | Wei Lei, Yi Xu, Yu Lei, Tae Hong Ha, Raymond Hung | 2022-08-16 |
| 11315771 | Methods and apparatus for processing a substrate | Xiangjin Xie, Fuhong Zhang, Martin Lee Riker, Lewis Yuan Tse Lo, Lanlan Zhong +2 more | 2022-04-26 |
| 11289329 | Methods and apparatus for filling a feature disposed in a substrate | Rui Li, Xiangjin Xie, Fuhong Zhang, Adolph Miller Allen, Lanlan Zhong +1 more | 2022-03-29 |
| 11222816 | Methods and apparatus for semi-dynamic bottom up reflow | Lanlan Zhong, Fuhong Zhang, Joung Joo Lee, Kishor Kalathiparambil, Xiangjin Xie +1 more | 2022-01-11 |