Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527484 | Dielectric filler material in conductive material that functions as fiducial for an electronic device | Jesse C. Jones, Gang Duan, Jason M. Gamba, Yosuke Kanaoka, Vishal Shajan | 2022-12-13 |
| 11508676 | Density-graded adhesion layer for conductors | Kemal Aygun, Srinivas V. Pietambaram, Cemil Geyik | 2022-11-22 |
| 11501967 | Selective metal deposition by patterning direct electroless metal plating | Suddhasattwa Nad, Roy Dittler, Darko Grujicic, Marcel Wall | 2022-11-15 |
| 11445616 | Interfacial layer for high resolution lithography (HRL) and high speed input/output (IO or I/O) architectures | Suddhasattwa Nad, Marcel Wall | 2022-09-13 |
| 11380472 | High-permeability magnetic-dielectric film-based inductors | Srinivas V. Pietambaram, Kristof Darmawikarta | 2022-07-05 |
| 11355438 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Srinivas V. Pietambaram, Gang Duan | 2022-06-07 |
| 11291122 | Apparatus with a substrate provided with plasma treatment | Darko Grujicic, Rengarajan Shanmugam, Sandeep Gaan, Adrian BAYRAKTAROGLU, Roy Dittler +4 more | 2022-03-29 |
| 11276634 | High density package substrate formed with dielectric bi-layer | Srinivas V. Pietambaram, David Unruh, Frank Truong, Kyu Oh Lee, Junnan Zhao +1 more | 2022-03-15 |
| 11257748 | Semiconductor package having polymeric interlayer disposed between conductive elements and dielectric layer | Suddhasattwa Nad | 2022-02-22 |