Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508662 | Device and method of very high density routing used with embedded multi-die interconnect bridge | Robert Alan May, Wei-Lun Kane Jen, Jonathan L. Rosch, Kristof Darmawikarta | 2022-11-22 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta, Robert L. Sankman +1 more | 2022-08-30 |