Issued Patents 2022
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532724 | Selective gate spacers for semiconductor devices | Scott B. Clendenning, Szuya S. Liao, Rami Hourani, Patricio E. Romero, Grant Kloster +1 more | 2022-12-20 |
| 11476164 | Integrated circuit structures having differentiated workfunction layers | Ying-Feng PANG, Dan S. LAVRIC, Ashish Agrawal, Robert Niffenegger, Padmanava Sadhukhan +2 more | 2022-10-18 |
| 11456248 | Etch stop layer-based approaches for conductive via fabrication and structures resulting therefrom | Cen Tan, Rami Hourani | 2022-09-27 |
| 11417567 | Conductive cap-based approaches for conductive via fabrication and structures resulting therefrom | Eungnak Han, Rami Hourani, Ruth A. Brain, Paul A. Nyhus, Manish Chandhok +2 more | 2022-08-16 |
| 11398428 | Multifunctional molecules for selective polymer formation on conductive surfaces and structures resulting therefrom | Eungnak Han, Tayseer Mahdi, Rami Hourani, Gurpreet Singh | 2022-07-26 |
| 11373950 | Advanced lithography and self-assembled devices | Richard E. Schenker, Robert L. Bristol, Kevin Lin, James M. Blackwell, Marie Krysak +6 more | 2022-06-28 |
| 11320734 | Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists | Marie Krysak, James M. Blackwell, Robert L. Bristol | 2022-05-03 |
| 11315798 | Two-stage bake photoresist with releasable quencher | Robert L. Bristol, Marie Krysak, James M. Blackwell, Kent N. FRASURE | 2022-04-26 |
| 11270887 | Passivation layer for germanium substrate | Patricio E. Romero, Scott B. Clendenning, Cen Tan | 2022-03-08 |
| 11232980 | Bottom-up fill dielectric materials for semiconductor structure fabrication and their methods of fabrication | Rami Hourani, Gopinath Bhimarasetti, James M. Blackwell | 2022-01-25 |
| 11227766 | Metal oxide nanoparticles as fillable hardmask materials | Marie Krysak, Manish Chandhok | 2022-01-18 |
| 11227798 | Metal aluminum gallium indium carbide thin films as liners and barriers for interconnects | Scott B. Clendenning | 2022-01-18 |