Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404365 | Direct attachment of capacitors to flip chip dies | Charles L. Arvin, Bhupender Singh, Mark W. Kapfhammer, Sylvain Pharand | 2022-08-02 |
| 11388821 | Thin film capacitors for core and adjacent build up layers | Charles L. Arvin, Charles L. Reynolds, Jean Audet, Francesco Preda | 2022-07-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Charles L. Arvin, Bhupender Singh | 2022-03-22 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Charles L. Arvin, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |