Issued Patents 2022
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522268 | Wireless device with substrate to antenna coupling | Hassan Ali | 2022-12-06 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse +2 more | 2022-11-15 |
| 11487206 | Methods and apparatus for digital material deposition onto semiconductor wafers | Daniel Lee Revier, Sean Chang, Scott R. Summerfelt | 2022-11-01 |
| 11417540 | 3D printed semiconductor package | Daniel Lee Revier | 2022-08-16 |
| 11404270 | Microelectronic device substrate formed by additive process | Daniel Lee Revier | 2022-08-02 |
| 11390527 | Multi-layered SP2-bonded carbon tubes | Nazila Dadvand, Luigi Colombo, Archana Venugopal | 2022-07-19 |
| 11387919 | High frequency CMOS ultrasonic transducer | Bichoy Bahr, Scott R. Summerfelt | 2022-07-12 |
| 11387271 | Optical sensor with trench etched through dielectric over silicon | Scott R. Summerfelt, Hassan Ali | 2022-07-12 |
| 11370662 | Hexagonal boron nitride structures | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2022-06-28 |
| 11355414 | Nanoparticle matrix for backside heat spreading | Nazila Dadvand, Daniel Lee Revier, Archana Venugopal | 2022-06-07 |
| 11320453 | Aging compensation of a ferroelectric piezoelectric shock sensor | Scott R. Summerfelt | 2022-05-03 |
| 11309388 | Multi-super lattice for switchable arrays | Luigi Colombo, Nazila Dadvand, Archana Venugopal | 2022-04-19 |
| 11296016 | Semiconductor devices and methods and apparatus to produce such semiconductor devices | Robert Allan Neidorff, Steven Kummerl, Barry Jon Male, Peter Smeys | 2022-04-05 |
| 11282807 | Nanowires plated on nanoparticles | Ralf Jakobskrueger Muenster, Sreenivasan K. Koduri | 2022-03-22 |
| 11282770 | Leadless packaged device with metal die attach | Nazila Dadvand, Sreenivasan K. Koduri | 2022-03-22 |
| 11270939 | Additively manufactured programmable resistive jumpers | Paul Merle Emerson | 2022-03-08 |
| 11264369 | Isolator integrated circuits with package structure cavity and fabrication methods | Barry Jon Male, Robert A. Neidorff, Steve Kummerl | 2022-03-01 |
| 11254775 | Filler particles for polymers | Nazila Dadvand, Archana Venugopal, Luigi Colombo | 2022-02-22 |
| 11258154 | Launch structures for a hermetically sealed cavity | Adam Joseph Fruehling, Juan Alejandro Herbsommer, Swaminathan Sankaran | 2022-02-22 |
| 11251138 | Through wafer trench isolation between transistors in an integrated circuit | Scott R. Summerfelt, Thomas D. Bonifield, Sreeram Subramanyam Nasum, Peter Smeys | 2022-02-15 |
| 11239195 | Nanowire interfaces | Sreenivasan K. Koduri, Ralf Jakobskrueger Muenster | 2022-02-01 |
| 11237223 | Magnetic flux concentrator for in-plane direction magnetic field concentration | Jo Bito, Dok Won Lee, Keith Ryan Green, Ricky Alan Jackson, William French | 2022-02-01 |