Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Makoto Yoshino, Ayumu Kuroda, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2022-11-15 |
| 11394361 | Buk acoustic wave resonator with guard rings having recessed space from electrode edge and periodic designs | Ting-Ta Yen, Ricky Alan Jackson, Nicholas Stephen Dellas | 2022-07-19 |