Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527350 | Multilayer coil component | Yuto SHIGA, Hajime Kato, Kazuya TOBITA, Youichi KAZUTA, Noriaki HAMACHI | 2022-12-13 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Kurt Peter Wachtler, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2022-11-15 |
| 11450638 | Bump bond structure for enhanced electromigration performance | Dibyajat Mishra, Ashok S. Prabhu, Tomoko Noguchi, Luu Thanh Nguyen, Anindya Poddar +1 more | 2022-09-20 |
| 11227721 | Electronic component | Yoji Tozawa, Masashi SHIMOYASU, Takuo Abe, Akihiko OIDE, Tsutomu Ono +6 more | 2022-01-18 |