Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538717 | Electronic package for integrated circuits and related methods | Anindya Poddar, Usman Mahmood Chaudhry | 2022-12-27 |
| 11538767 | Integrated circuit package with partitioning based on environmental sensitivity | Barry Jon Male, Paul Merle Emerson | 2022-12-27 |
| 11498831 | Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip | Makoto Yoshino, Ayumu Kuroda, Brian E. Goodlin, Karen Hildegard Ralston Kirmse, Benjamin Stassen Cook +2 more | 2022-11-15 |
| 11387782 | Stacked-die bulk acoustic wave oscillator package | Ricky Alan Jackson | 2022-07-12 |